Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bonding
DOI:
https://doi.org/10.58368/MTT.23.3-4.2024.7-16Keywords:
Flip Chip Bonding, Cu Pillars, Shear Strength, Bond TestingAbstract
The application of flip-chip bonding utilizing copper (Cu) pillars has increasingly gained prominence for low-temperature chip-to-chip and chip-to-wafer integration in micro-electromechanical systems (MEMS). A critical factor influencing the bonding efficacy of Cu pillars is the thermal conductivity of the base substrate or chip material. This study aims to systematically assess the bonding strength of Cu-Cu pillar bonds fabricated on silicon (Si) and glass substrates. Employing Hertzian contact theory and Fick’s laws, analysis of the operational parameters pertinent to the experimental evaluation of the impact of substrate material on bonding strength. The experiments show that better bonding of Cu pillars held at bonding temperatures of 180°C and 200°C with the shear strength of 0.0129 MPa and 0.00544 MPa for Cu-Cu pillars bonded through flip chip bonding with silicon and glass substrates, respectively.
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