Vol. 23 No. 3-4 (2024): March-April 2024

Articles

• Design optimization of silicon cantilever for strain based MEMS position sensor

  G. N. Vikas, Megha Agrawal

  1-6

  • pdf

• Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bonding

  N. Chaitra, C. B. Harshitha, S. Harsha, Ajay Jaswal

  7-16

  • pdf

• Resolving fabrication issues in photolithography and thin film deposition

  Babu Angadi, S. Mahalakshmi, D. Devika Bai, Prabhanjan D. Kulkarni, S. Harsha

  17-23

  • pdf