Experimental investigation on the stability of electro chemical discharge machining (ECDM)

Authors

  • Dil Bahar Indian Institute of Technology Roorkee, Roorkee, India
  • Akshay Dvivedi Indian Institute of Technology Roorkee, Roorkee, India
  • Pradeep Kumar Indian Institute of Technology Roorkee, Roorkee, India

DOI:

https://doi.org/10.58368/MTT.22.5.2023.63-70

Keywords:

TGV, Stability, Probability Chart, I-MR Chart, EDS

Abstract

Through Glass Vias (TGV) are preferred over Through Silicon Vias (TSV) for 5G wireless transmission because of their non-conducting nature, which lowers the losses. Due to the limitations of current methods, ECDM is an evolving method for micromachining glass. ECDM is a hybrid machining process, encompassing the characteristics of electro discharges and electrochemical machining. But in the hydrodynamic regime, bubble buildup and sludge formation in the micro-machining zone degrade the ECDM’s ability to channel energy. Additionally, the presence of a thermal gradient (produced by thermal discharges) encourages the thermal diffusion of the electrolyte and steadily raises its temperature, which destabilizes the process and hampers its commercial viability. In the present communication, a study on the stability of ECDM process has been conducted by using Shewhart control charts (I-MR Chart) with Probability plots. Outcomes from the control charts witnessed an unstable state of the ECDM process. Subsequently, possible causes are identified, and remedial action has been suggested for future work.

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Published

01-05-2023

How to Cite

Bahar, D., Dvivedi, A., & Pradeep Kumar. (2023). Experimental investigation on the stability of electro chemical discharge machining (ECDM). Manufacturing Technology Today, 22(5), 63–70. https://doi.org/10.58368/MTT.22.5.2023.63-70

Issue

Vol. 22 No. 5 (2023): May 2023

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Articles

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