Effect of repetition rate and peak fluence on ablation depth with ultrashort pulse laser irradiation in silicon
DOI:
https://doi.org/10.58368/MTT.22.6.2023.54-60Keywords:
Ultrashort Pulse Laser, Micromachining, Silicon, Repetition Rate, Peak FluenceAbstract
The demand for high-depth micro features in silicon are highly desired for microelectromechanical systems (MEMS) applications. Silicon, which is brittle, has low toughness characteristics and possesses high reflectivity, makes it highly challenging to fabricate high-depth micro features. In the present work, we explore the ablation mechanism for low (0.28 J/cm2) and high peak (6.36 J/cm2) fluence at various repetition rates (100-500 kHz) to create high-depth microchannels in silicon. The maximum depth of 6.64 and 107.73 µm are obtained at low and high peak fluence and repetition rate of 500 kHz. The higher deposition of fine particles is observed at a high peak fluence of 6.36 J/cm2. Higher peak fluence can be more effective in creating high-depth microchannels with the deposition of fine particles at the edge of the microchannels. Present work will be highly beneficial where high-depth micro features in silicon are desired, which is highly challenging to fabricate.
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