Experimental analysis of conformality of E–beam deposited thin films for MEMS applications

Abstract

The uses of metal thin films are versatile and very well established in the field of CMOS and MEMS devices. Although, today’s many system manufacturing units provides facility to control the physical parameters such as thickness uniformity and deposition rate. However, the impact of tool parameters must be optimized to understand and quantify for better process control. In this work, we have studied a qualitative conformality of metal thin films deposited with E- beam evaporation method. This is very important parameter for realization of MEMS devices, particularly for Through Silicon Via (TSV), MEMS Probe Card and G Switches. In this work, we present detailed qualitative study of metal filling over the bulk micro machined trench patterns and estimate the conformality values with two different types of rotation setup provided in E-beam tool for batch process of MEMS on to the 6” Si wafers.