Yogya, M. Prardhan, and Megha Agrawal. “Low Temperature Cu-Cu Thermo-Compression Bonding for Advanced Micro-System Packaging”. Manufacturing Technology Today 19, no. 9 (September 1, 2020): 46–50. Accessed September 19, 2024. https://mtt.cmti.res.in/index.php/journal/article/view/127.