Naidu, P. Ravi Teja, Vijay Kumar, and Jaspreet Singh. “Low Temperature Anodic Bonding Process With Silicon-Gold-Glass Interface for Wafer Level Packaging Applications”. Manufacturing Technology Today 19, no. 10 (October 1, 2020): 59–63. Accessed November 23, 2024. https://mtt.cmti.res.in/index.php/journal/article/view/116.