Reddy, A. M., M. N. Islam, S. K. Dash, B. S. Srinivasa, and Y. R. Bhanumathy. “Relevance of 3D X-Ray Imaging for Electronic Packages and Printed Circuit Boards”. Manufacturing Technology Today, vol. 19, no. 9, Sept. 2020, pp. 29-33, https://mtt.cmti.res.in/index.php/journal/article/view/124.