CHAITRA, N.; HARSHITHA, C. B.; HARSHA, S.; JASWAL, A. Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bonding. Manufacturing Technology Today , [S. l.], v. 23, n. 3-4, p. 7–16, 2024. DOI: 10.58368/MTT.23.3-4.2024.7-16. Disponível em: https://mtt.cmti.res.in/index.php/journal/article/view/310. Acesso em: 28 sep. 2026.