HARSHA, S.; MAHALAKSHMI , S.; GEORGE, A. Functional evaluation of copper in conventional wire bonding as compared to gold. Manufacturing Technology Today , [S. l.], v. 18, n. 3, p. 62–67, 2019. Disponível em: https://mtt.cmti.res.in/index.php/journal/article/view/243. Acesso em: 19 sep. 2024.