YOGYA, M. P.; AGRAWAL, M. Low temperature Cu-Cu thermo-compression bonding for advanced micro-system packaging. Manufacturing Technology Today , [S. l.], v. 19, n. 9, p. 46–50, 2020. Disponível em: https://mtt.cmti.res.in/index.php/journal/article/view/127. Acesso em: 4 dec. 2024.