REDDY, A. M.; ISLAM, M. N.; DASH, S. K.; SRINIVASA, B. S.; BHANUMATHY, Y. R. Relevance of 3D x-ray imaging for electronic packages and printed circuit boards. Manufacturing Technology Today , [S. l.], v. 19, n. 9, p. 29–33, 2020. Disponível em: https://mtt.cmti.res.in/index.php/journal/article/view/124. Acesso em: 24 nov. 2024.