NAIDU, P. R. T.; VIJAY KUMAR; SINGH, J. Low temperature anodic bonding process with silicon-gold-glass interface for wafer level packaging applications. Manufacturing Technology Today , [S. l.], v. 19, n. 10, p. 59–63, 2020. Disponível em: https://mtt.cmti.res.in/index.php/journal/article/view/116. Acesso em: 23 nov. 2024.