Chaitra, N., Harshitha, C.B., Harsha, S. and Jaswal, A. 2024. Study on the effect of substrate material on the mechanical strength of Cu bonds bonded through flip chip bonding. Manufacturing Technology Today . 23, 3-4 (Mar. 2024), 7–16. DOI:https://doi.org/10.58368/MTT.23.3-4.2024.7-16.